Kaynes Semicon Bolsters India’s Chip Ambitions with Synopsys Simulation Integration
#KaynesSemicon #Synopsys #Semiconductors #MakeInIndia #OSAT #Sanand #ChipDesign #ElectronicsManufacturing #TechInnovation #IndiaTech“We are delighted to support Kaynes Semicon’s vision of elevating India’s OSAT manufacturing excellence. This collaboration is also a reflection of our shared commitment to build world-class manufacturing capabilities that not only strengthen reliability and performance, but also positions India as a global innovation hub.” - Murali Pullela, Country Head (Simulation & Analysis) - Synopsys
February 2026 : In a move that significantly elevates India’s standing in the global semiconductor value chain, Kaynes Semicon has recently announced the strategic adoption of Synopsys’ advanced engineering simulation software. This integration at Kaynes’ state-of-the-art Sanand facility is set to redefine the quality, reliability, and speed-to-market of India’s Outsourced Semiconductor Assembly and Testing sector.
By embedding Synopsys’ Multiphysics simulation tools into its R&D and production workflows, Kaynes Semicon is moving toward a "simulation-led reliability" model. This approach allows for full-package design optimization from the initial concept phase through to qualification - critical for complex modern architectures like 3D-ICs, high-performance computing, and AI-driven chips.
The collaboration, facilitated through the Ansys Channel Partner program with Infinipoint Technologies, allows Kaynes to deploy industry-leading solutions for thermal management and electronics reliability.
Raghu Panicker, CEO of Kaynes Semicon, highlighted the strategic importance of this leap: “Integrating Synopsys’ advanced simulation capabilities marks an important step in Kaynes Semicon’s mission to build globally competitive OSAT manufacturing from India. As semiconductor packaging becomes increasingly complex, simulation-led engineering helps us enhance reliability, optimize performance, and accelerate innovation across high-growth applications such as AI, high-performance computing, automotive, and power electronics.”
The partnership underscores a shared vision to transform India into a resilient, high-tech manufacturing hub. By optimizing workflows such as Flip-Chip Quad Flat No-lead (FC-QFN) and System-in-Package (SiP), Kaynes is poised to reduce development timelines and improve yield efficiency for its global clientele.
Murali Pullela, Country Head (Simulation & Analysis) at Synopsys, remarked: “We are delighted to support Kaynes Semicon’s vision of elevating India’s OSAT manufacturing excellence. This collaboration is also a reflection of our shared commitment to build world-class manufacturing capabilities that not only strengthen reliability and performance, but also positions India as a global innovation hub.”
With this move, Kaynes Semicon reinforces its commitment to the ‘Make in India’ initiative, proving that the future of Indian semiconductors is not just about assembly, but about world-class, reliability-driven engineering.
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